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Etching Laboratory

The etching operation is needed to obtain a surface finish free from any impurity.

Some characteristics of the installation

  • mixture of phosphoric, nitric and hydrofluoric acids
  • average etching rate : 0.5 µm/minute
  • typical etching depth : from 10 to 250 µm
  • evacuation and recycling unit of the toxic gase emissions and liquid effluents

Surface observation capabilities

  • ultrasonic probe (local depth measurement)
  • roughness meter
  • optical microscope (×1000)
For more information ...



Institut de Physique Nucléaire Orsay - 15 rue Georges CLEMENCEAU - 91406 ORSAY (FRANCE)
UMR 8608 - CNRS/IN2P3

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